DMG TECO
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DMG TECO Total-Etch Bonding System
DMG TECO is an innovative total-etch bonding system designed to deliver outstanding bond strength with maximum convenience. Along with its excellent adhesive performance, TECO stands out due to its unique DMG-patented single-dose application format, the SilvR dose.
The material is freshly activated by simply pressing the silver chamber and is ready for immediate use. Application is performed in just one step, using one hand, ensuring a fast, clean, and controlled bonding procedure with reliable clinical results.
Indications
- Light-curing dentine and enamel bonding agent using the total-etch technique
- For use with light-curing composites and compomers
- Direct and indirect restorations for cavity classes I – V
Contraindications
- Do not use without dentine etching
- Do not use with chemically curing composites or compomers
- Do not use with dual-curing composites or compomers unless light-cured
- Do not use in cases of allergy to any components
- Do not use directly on exposed pulp or in cases of pulpitis
Features
- Reliable total-etch bonding with push-button convenience
- Microtensile bond strength up to 38 MPa
- Non-acetone formulation compatible with all curing lights
- Patented SilvR single-dose activation system
- One-step, one-hand, clean and fast application
- Proven total-etch technology for durable adhesion
- Suitable for wet or moist bonding techniques
Composition
- TECO: Bis-GMA-based resin matrix, starter system, additives
- DMG Etching Gel: 37% o-phosphoric acid in water, Aerosil
Key Specifications
- Total-etch bonding system
- Light-curing adhesive
- Minimum curing light intensity: 400 mW/cm²
- Compatible with all standard curing lights (≈450 nm)
Interactions with Other Materials
- Do not use with materials that inhibit polymerization
- Avoid eugenol-containing products such as temporary cements
Directions to Use
- Prepare the cavity according to adhesive principles and bevel enamel edges
- Use pulp protection where necessary (calcium hydroxide and glass ionomer liner)
- Etch enamel and dentine with 37% phosphoric acid (20–60 s for enamel, max. 15 s for dentine)
- Rinse for at least 15 seconds and leave dentine evenly moist
- Apply TECO generously and scrub into tooth structure for 20 seconds
- Remove excess material
- Gently air-thin to an even layer (approx. 5 seconds)
- Light-cure for 10 seconds
- Proceed with restorative material according to manufacturer’s instructions
Packaging
- 1 Ă— 5 ml Bottle



















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